INVESTIGATION OF WAYS TO REMOVE OXIDE FILM FROM THE SURFACE OF METALS AND SOLDER MATERIALS IN THE SOLDERING PROCESS UNDER DIFFERENT CONDITIONS
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- Published: Monday, 07 June 2021 19:32
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Volume 7 (3), June 2021, Pages 64-73
1Agali Guliyev, 2Aynur Sharifova, 3Svetlana Hajiyeva
1Associate Professor, “Mechanical Engineering and Materials Science”, Azerbaijan State Oil and Industry University, Doctor of Philosophy, Azerbaijan. E-mail: This email address is being protected from spambots. You need JavaScript enabled to view it.
2Assistant, “Mechanical Engineering and Materials Science”, Azerbaijan State Oil and Industry University, Doctor of Philosophy, Azerbaijan. E-mail: This email address is being protected from spambots. You need JavaScript enabled to view it.. https://orcid.org/0000-0002-4591-8013
3Assistant, “Mechanical Engineering and Materials Science”, Azerbaijan State Oil and Industry University, Azerbaijan. E-mail: This email address is being protected from spambots. You need JavaScript enabled to view it.
ABSTRACT
The article considers important to study the issues of removal of oxide films from the surface of metals and solder materials and the increase of homogeneity of the space in the process of soldering under the active gas and vacuum conditions. Theoretical and experimental studies have shown that the process of self-fluxing is mainly associated with the reduction of adsorption forces, dispersion of oxide films and solubility in solder.
Keywords: steel unit, copper-phosphorus alloy, active gas-vacuum, melting temperature, cracking, wetting, oxide film, self-fluxing, microstructure, hardening.